ALLTEQ  L-1520e Die Coating / Dispensing Station
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Die Overcoat or Die Coating  is the process of applying a pliant but moisture-resistive material over the surface of the die for the purpose of minimizing package stresses on the surface of the die and providing additional protection against corrosion.  Silicone materials are very effective for this purpose.  Die coating may be selective or non-selective.  Selective die coating, as the name implies, dispenses overcoat material on certain areas of the die only.  Non-selective or full die coating covers the entire surface of the die with overcoat material.  The amount of overcoat material dispensed on the die surface should be calculated properly, as excess overcoat material that rise above the ball bond may exert tremendous shearing stresses on the wire, resulting in neck breaks.

Built to dispense a wide range of materials. For Die Over Coat, Dam and Fill, Under Fill, Selective Area Coating, Spray Coating & Cleaning...

Model L-1520 Programmable XY Die Coating System        Model L-1531 Spot UV Die Coating System
 L-1520e                                                                                   Time Pressure Dispensing


Spray System                                            Spray Monitoring
               
New Spray Head Coating        Dual Head Spray Coating                                Pressure Vessel

Die Stress - Generation of excessive package stresses on the die which may result in electrical failure; this is alleviated by die over-coating

 

MACHINE VISION FOR DIE COATING 

Machine Overview 
The L-1520e is  fully automatic station designed to apply various materials to the surface of a die or package.  The programmable Z feature on the 1520e is a high speed, stepper motor controlled positioning unit that allows for deep cavity and close proximity dispensing and facilitates "tail breaking" on materials with high viscosity's.  The 1520e is supplied with a 1.4"x 2.4" XY positioning capability for pattern, dot, multi-chip or large area dispensing.  The system can store up to 100 specified programs.  Each program includes parameters such as dispense time, delay time, device location and Z position. The indexing mechanism on the 1520e is a simple, gentle and highly reliable mechanism for positioning a device under the dispense head for the die coating operation.  The indexer is a low maintenance,  single magazine input/output system that will assure very low down-time for many years of hard use.   The simple mechanical design of the machines indexer will allow for leadframe change-over, from .600" to 3.150" in one minute or less.  Not only is the 1520e easy to operate and maintain, but a network of factory trained field support personnel are ready to service the equipment anywhere in the world.  Because floor space in an important concern, the 1520e has been designed as a bench top units 24" deep x 33" x 14" tall. 
STANDARD FEATURES L-1520e 
  •   Menu Driven Software
  •   Programmable Z head control
  •   Programmable XY stage
  •   Programmable dispense time
  •   Programmable delay time
  •   Programmable leadframe pitch
  •   Programmable pressure regulator
  •   600" to 3.150" leadframe Capability
  •   250 Program Storage 
  •   Status Tower / Green-Yellow-Red
  •   Fast product change over
  •   Single magazine elevator
  •   Built in diagnostics
  •   Allteq reliability

SPECIFICATIONS
PHYSICAL
Weight: 
Depth: 
Width: 
Height:
Tower: 		 135 lbs.  
24 inches  
33 inches 
14 inches (less tower)
add 20"
 
FACILITIES
Power:
Air: 		 115/230V 250W 50/60Hz 
70 PSI Min 

ELECTRONICS
Microprocessor: 
Battery backup:  
Display: 
68331 
10 Year 
2 x 40 

MECHANICAL
X Travel:
Y Travel:
Z Travel: 
Leadframe Width:
Indexer Accuracy:   
Frame Changeover: 
 1.40"
2.40"
1.10" 
.600" to 3.150"
+/- .004" 
60 Sec. 

OPERATIONS
Cycle Time: 7000 UPH (10 Device Leadframe)

The 1500 Series Runs a wide range of matirial inculding but not limited to products from Dow Corrning

Dow Corning Brand Product Description Features Potential Uses
HIPEC R 6101 Semiconductor Protective Coating 1-part heat cure clear, good flowability, soft elastomer, self priming adhesion Excellent adhesion, light transmission, flexible at high and low temperatures Protection of discrete devices such as transistors and rectifiers
HIPEC R 6102 Semiconductor Protective Coating 1-part heat cure black, good flowability, soft elastomer, self priming adhesion Excellent adhesion, blockage for light sensitive devices, flexible at high and low temperatures Protection of discrete devices such as transistors and rectifiers
Dow Corning JCR 6224 1-part, heat cure black, thixotropic, DRAM grade Excellent workability, long pot life at room temperature, excellent printing capability; excellent adhesion, thermal stability and electrical properties Good flowability encapsulant for chip scale packages that require DRAM-grade purity
HIPEC Q1-4939 Semiconductor Protective Coating 2-part clear heat cure, cures to elastomer or gel depending on mix ratio, good flowability Solventless silicone gel or elastomer; protection from thermo-mechanical shock Sealing, preserving and protecting complex, integrated circuits
HIPEC Q1-9239 Semiconductor Protective Coating 1-part, black heat cure, controlled thixotropy-flowable as dispensed, self priming adhesion Fast heat cure; excellent adhesion; flexible over wide temperature range For applications where a semiconductor die has been wire bonded to a flat surface
HIPEC Q3-6646 Semiconductor Protective Coating 2-part clear heat cure gel, very low viscosity, long working time, enhanced low temp capability Solventless silicone gel or elastomer; protection from thermo-mechanical shock Sealing, preserving and protecting complex, integrated circuits

Die Encapsulant Overview - Dow Corning

Technical Data  

Tutorial

 

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All of Allteq's agents are factory trained to assure customer satisfaction.

                                             
Note: Specifications subject to change without notice.
Effective 1/23/08

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